特性/ Features
Tg：135±5℃ （DSC）
优异的耐漏电起痕性，CTI≥600 / Excellent tracking resistance ,CTI ≥600
UV Blocking与 AOI兼容/UV Blocking and AOI compatible
优良的PCB加工性 / Good PCB processability
主要特性 / General properties
检测项目 Item | 单位 Unit | 检测条件 Test Condition | 规范值 Spec | 典型值 Typical Value | |
玻璃化转变温度Tg | ℃ | DSC | 135±5 | 135.2 | |
剥离强度 1oz Peel Strength | N/mm | 288℃, 10S | ≥1.40 | 1.75 | |
热应力 Thermal stress | S | 288℃,solder dip | ＞10 | 60 s No delamination | |
弯曲强度 Flexural Strength | N/mm2 | 经向 LW | ≥415 | 577 | |
纬向CW | ≥345 | 470 | |||
燃烧性Flammability | － | E 24/125 | UL94V-0 | V-0 | |
表面电阻 SurfaceResistivity | MΩ | After moisture | ≥1.0×104 | 5.12×107 | |
体积电阻 Volume Resistivity | MΩ·cm | After moisture | ≥1.0×106 | 5.25×108 | |
介电常数 Dielectric Constant | － | C 24/23/50 | ≤5.4 | 4.6 | |
介质损耗角正切 Loss Tangent | － | C 24/23/50 | ≤0.035 | 0.015 | |
耐电弧Arc Resistance | S | D48/50＋D0.5/23 | ≥60 | 120 | |
击穿电压 Dielectric Breakdown | KV | D48/50＋D0.5/23 | ≥40 | 57 | |
吸水率Moisture Absorption | % | D24/23 | ≤0.35 | 0.15 | |
热分解温度Td | ℃ | Weight Loss 5% | － | 310 | |
CTE Z-axis | Alpha 1 | ppm / ℃ | TMA | － | 60 |
Alpha 2 | ppm / ℃ | － | 300 | ||
50 - 260 ℃ | % | － | 4.2 | ||
T288 | min | TMA | － | 1 | |
相比漏电起痕指数 CTI | V | IEC-60112 | ≥600 | 600 | |
Specimen Thickness : 1.6mm ;
Specification sheet：IPC-4101C/97，is for your reference only
Explanation: C: Humidity conditioning;
D: Immersion conditioning in distilled water ;
应用领域/ Applications
电源基板、电视机、电冰箱、洗衣机等。
Power base board、TV、refrigerator、 washing machine and etc.
产品系列 / Purchasing information
厚度Thickness | 铜箔Copper foil | 标准尺寸 Standard size |
0.63~3.2mm | 12um ~ 105um | 37"×49"、41"×49"、43"×49" |